Electronic Specifier Design - July 2011 - (Page 24) power Enhanced Packaging Packs More Power D From brick power supplies to low power motor drives, International Rectifier’s Hemal Shah looks at improving efficiency and power density in industrial applications. combination of conduction and switching performance throughout a range of low and medium voltage ratings. Package innovations are focused on reducing parasitic effects such as die-free package resistance, DFPR, and package inductance, which contribute power losses as well as restricting device performance in terms of current rating and switching speed. Unwanted inductance in package wire bonds and the lead frame can contribute to maintaining an appreciable voltage at the gate, so preventing the gate driver from turning the device off. This effectively delays turn off, which in turn, increases power loss in the MOSFET leading to lower conversion efficiency. In addition, stray inductances can cause voltage spikes in the circuit, which can exceed the device voltage rating leading to failure. Package improvements aimed at reducing the electrical resistance and improving the thermal performance also permit significantly increased current handling within small package dimensions. They also help cooling, leadwww.electronicspecifier.com emand for high energy efficiency is common for most electronic product design projects, including non-consumer equipment such as industrial motor drives and telecom network infrastructure. As far as power supplies are concerned, high power density and reliability are also desirable so as to offer better overall cost of ownership. As switched mode power conversion has become the industry norm, delivering inherently higher power density and efficiency compared to linear power supplies, component designers have continued to improve the conduction and switching performance of power MOSFETs through innovation at the silicon level, as well as improvements to packaging. Successive generations of silicon have delivered progressive improvements in the trade-off between on state resistance and parameters influencing switching performance, such as gate charge. IR currently has a number of silicon variants providing power supply designers with the opportunity to select devices offering an optimal 24 | july 2011 | electronicspecifierdesign http://www.electronicspecifier.com http://www.electronicspecifier.com Table of Contents for the Digital Edition of Electronic Specifier Design - July 2011 Electronic Specifier Design - July 2011 Table of Contents Power: Alleviating SiC Costs in Power Designs Interconnection: Space Connections Actives : Amplifiers Et Al Software Virtualisation: Enterprise Protection Power: Enhanced Packaging Packs More Power Energy Harvesting: Missing Link Shapes Up For Energy Harvesting Embedded: Driving Standards ASICs: Exposing the Hidden Costs of Off the Shelf Analogue ICs Wireless: Serial RapidIO Vs. 10Gbit Ethernet Interconnection: Freely Unleashing Creativity Networking: OTN Continues To Drive Carrier Network Efficiency Electronic Specifier Design - July 2011 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201301 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201212 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201211 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201210 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201209 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201208 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201207 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201206 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201205 http://europe.nxtbook.com/nxtbooks/electronicspecifier/design_201205 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201204 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201203 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201202 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201201 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201112 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201111 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201110 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201109 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201108 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201107 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201106 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201105 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201104 http://europe.nxtbook.com/nxteu/electronicspecifier/design_201103 http://www.nxtbookMEDIA.com
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